AMD Ryzen 3 3200G vs Intel Pentium B950

Last updated:

CPU comparison with benchmarks

-VS-

CPU lineage

AMD Ryzen 3 3200G or AMD Ryzen 3 3200G – which processor offers superior performance? In this comparison, we examine disparities and assess which of these two CPUs outperforms the other. We delve into technical specifications and benchmark outcomes.
The AMD Ryzen 3 3200G features 4 processor cores and has the capability to manage 4 threads concurrently.
It was released in Q2/2019 and belongs to the 2 generation of the AMD Ryzen 3 series.
To use the AMD Ryzen 3 3200G, you'll need a motherboard with a AM4 (PGA 1331) socket.
The Intel Pentium B950 features 2 processor cores and has the capability to manage 2 threads concurrently.
It was released in Q2/2011 and belongs to the 3 generation of the Intel Pentium series.
To use the Intel Pentium B950, you'll need a motherboard with a PGA 988 socket.
Desktop / Server Segment Mobile
AMD Ryzen 3 3200G Name Intel Pentium B950
AMD Ryzen 3 Family Intel Pentium
2 Generation 3
AMD Ryzen 3000G Group Intel Pentium 900
 
 

CPU Cores and Base Frequency

The AMD Ryzen 3 3200G has 4 CPU cores and can calculate 4 threads in parallel.
The clock frequency of the AMD Ryzen 3 3200G is 3.6 GHz
and turbo frequency for one core is 4.0 GHz.
The Intel Pentium B950 has 2 CPU cores and can calculate 2 threads in parallel.
The clock frequency of the Intel Pentium B950 is 2.1 GHz
4.0 GHz Turbo Frequency (1 core) None
Yes Overclocking No
normal Core architecture normal
3.6 GHz Frequency 2.1 GHz
4 Threads 2
3.8 GHz Turbo Frequency (all cores) None
No Hyperthreading No
4 CPU Cores 2
4x Cores 2x
 
 

Internal Graphics

The AMD Ryzen 3 3200G has integrated graphics, called iGPU for short.
Specifically, the AMD Ryzen 3 3200G uses the AMD Radeon Vega 8 Graphics, which has 512 texture shaders
and 8 execution units.
The iGPU uses the system's main memory as graphics memory and sits on the processor's die.
The Intel Pentium B950 has integrated graphics, called iGPU for short.
Specifically, the Intel Pentium B950 uses the Intel HD Graphics (Sandy Bridge GT1), which has 48 texture shaders
and 6 execution units.
1.25 GHz GPU frequency 0.65 GHz
Q1/2018 Release date Q2/2011
12 Direct X 10.1
AMD Radeon Vega 8 Graphics GPU name Intel HD Graphics (Sandy Bridge GT1)
14 nm Technology 32 nm
-- Max. displays --
512 Shaders 48
2.0 GB Max. GPU Memory 2.0 GB
8 Execution units 6
8 Generation 6
-- GPU (Turbo) 1.1 GHz
 
 

Artificial Intelligence and Machine Learning

-- AI specifications --
-- AI hardware --
 
 

Hardware codec support

A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.
Decode / Encode AVC Decode / Encode
Decode VC-1 Decode
Decode / Encode VP9 No
Decode / Encode h265 / HEVC (10 bit) No
Decode / Encode h264 Decode / Encode
Decode / Encode VP8 No
Decode / Encode h265 / HEVC (8 bit) No
Decode / Encode JPEG No
No AV1 No
 
 

Memory & PCIe

The processor supports a maximum memory capacity of 64.0 GB distributed across 2 memory channels. It offers a peak memory bandwidth of 46.9 GB/s. Both the type and quantity of memory can have a substantial impact on the overall system performance.
The processor supports a maximum memory capacity of 16.0 GB distributed across 2 memory channels. It offers a peak memory bandwidth of 21.3 GB/s. Both the type and quantity of memory can have a substantial impact on the overall system performance.
2 Memory channels 2
64.0 GB Max. Memory 16.0 GB
pci PCIe pci
Yes AES-NI Yes
Yes ECC No
46.9 GB/s Bandwidth 21.3 GB/s
DDR4-2933 Memory type DDR3-1066, DDR3-1333
 
 

Thermal Management

The processor has a thermal design power (TDP) of 65 W watts.
TDP indicates the cooling solution needed to effectively manage the processor's heat. It generally provides an approximate indication of the actual power consumption of the CPU itself.
The processor has a thermal design power (TDP) of 35 W watts.
95 °C Tjunction max 85 °C
65 W TDP (PL1 / PBP) 35 W
45 W TDP down None
 
 

Technical details

The AMD Ryzen 3 3200G is manufactured using a 12 nm process.
A smaller manufacturing process indicates a more contemporary and energy-efficient CPU.
In total, this processor boasts a generous 4.0 MB cache.
A substantial cache can significantly enhance the processor's performance, particularly in scenarios like gaming.
The Intel Pentium B950 is manufactured using a 32 nm process.
In total, this processor boasts a generous 2.0 MB cache.
Q2/2019 Release date Q2/2011
-- Part Number --
2.0 MB L2-Cache 0 bytes
AMD-V, SVM Virtualization VT-x, VT-x EPT, VT-d
SSE4a, SSE4.1, SSE4.2, FMA3, AVX2 ISA extensions SSE4.1, SSE4.2
Chiplet Chip design Monolithic
Picasso (Zen+) Architecture Sandy Bridge U
12 nm Technology 32 nm
AM4 (PGA 1331) Socket PGA 988
Windows 10, Linux, Windows 11 Operating systems Windows 10, Linux
95 $ Release price --
Technical data sheet Documents Technical data sheet
x86-64 (64 bit) Instruction set (ISA) x86-64 (64 bit)
4.0 MB L3-Cache 2.0 MB
 
 

Benchmarks

Geekbench 6 (Multi-Core)

AMD Ryzen 3 3200G
4C 4T @ 3.6 GHz
3276
3276
Intel Pentium B950
2C 2T @ 2.1 GHz
671
671

Geekbench 5, 64bit (Multi-Core)

AMD Ryzen 3 3200G
4C 4T @ 3.6 GHz
2900
2900
Intel Pentium B950
2C 2T @ 2.1 GHz
776
776

CPU-Z Benchmark 17 (Multi-Core)

AMD Ryzen 3 3200G
4C 4T @ 3.6 GHz
1662
1662
Intel Pentium B950
2C 2T @ 2.1 GHz
321
321

Geekbench 6 (Single-Core)

AMD Ryzen 3 3200G
4C 4T @ 3.6 GHz
1084
1084
Intel Pentium B950
2C 2T @ 2.1 GHz
379
379

AMD Ryzen 3 3200G and Intel Pentium B950 in leaderboards