HiSilicon Kirin 950 vs AMD Ryzen 3 4300G

HiSilicon Kirin 950 or HiSilicon Kirin 950 – which processor offers superior performance? In this comparison, we examine disparities and assess which of these two CPUs outperforms the other. We delve into technical specifications and benchmark outcomes.
The HiSilicon Kirin 950 features 8 processor cores and has the capability to manage 8 threads concurrently.
It was released in Q4/2015 and belongs to the 4 generation of the HiSilicon Kirin series.
The AMD Ryzen 3 4300G features 4 processor cores and has the capability to manage 8 threads concurrently.
It was released in Q3/2020 and belongs to the 3 generation of the AMD Ryzen 3 series.
To use the AMD Ryzen 3 4300G, you'll need a motherboard with a AM4 (PGA 1331) socket.

The HiSilicon Kirin 950 has 8 CPU cores and can calculate 8 threads in parallel.
The clock frequency of the A-Core is 2.3 GHz.
The number of CPU cores greatly affects the speed of the processor and is an important performance indicator.
Processors with hybrid (big.LITTLE) architecture strike a balance between performance and power efficiency, making them ideal for mobile devices.
The AMD Ryzen 3 4300G has 4 CPU cores and can calculate 8 threads in parallel.
The clock frequency of the AMD Ryzen 3 4300G is 3.8 GHz
and turbo frequency for one core is 4.0 GHz.

The HiSilicon Kirin 950 has integrated graphics, called iGPU for short.
Specifically, the HiSilicon Kirin 950 uses the ARM Mali-T880 MP4, which has 64 texture shaders
and 4 execution units.
The iGPU uses the system's main memory as graphics memory and sits on the processor's die.
The AMD Ryzen 3 4300G has integrated graphics, called iGPU for short.
Specifically, the AMD Ryzen 3 4300G uses the AMD Radeon 6 Graphics (Renoir), which has 384 texture shaders
and 6 execution units.

A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.

The processor supports a maximum memory capacity of 32.0 GB distributed across 2 memory channels. It offers a peak memory bandwidth of 51.2 GB/s. Both the type and quantity of memory can have a substantial impact on the overall system performance.

TDP indicates the cooling solution needed to effectively manage the processor's heat. It generally provides an approximate indication of the actual power consumption of the CPU itself.
The processor has a thermal design power (TDP) of 65 W watts.

The HiSilicon Kirin 950 is manufactured using a 16 nm process.
A smaller manufacturing process indicates a more contemporary and energy-efficient CPU.
A substantial cache can significantly enhance the processor's performance, particularly in scenarios like gaming.
The AMD Ryzen 3 4300G is manufactured using a 7 nm process.
In total, this processor boasts a generous 4.0 MB cache.