HiSilicon Kirin 970 vs Qualcomm Snapdragon 730

HiSilicon Kirin 970 or HiSilicon Kirin 970 – which processor offers superior performance? In this comparison, we examine disparities and assess which of these two CPUs outperforms the other. We delve into technical specifications and benchmark outcomes.
The HiSilicon Kirin 970 features 8 processor cores and has the capability to manage 8 threads concurrently.
It was released in Q3/2017 and belongs to the 6 generation of the HiSilicon Kirin series.

The HiSilicon Kirin 970 has 8 CPU cores and can calculate 8 threads in parallel.
The clock frequency of the A-Core is 2.4 GHz.
The number of CPU cores greatly affects the speed of the processor and is an important performance indicator.
Processors with hybrid (big.LITTLE) architecture strike a balance between performance and power efficiency, making them ideal for mobile devices.

The HiSilicon Kirin 970 has integrated graphics, called iGPU for short.
Specifically, the HiSilicon Kirin 970 uses the ARM Mali-G72 MP12, which has 192 texture shaders
and 12 execution units.
The iGPU uses the system's main memory as graphics memory and sits on the processor's die.
The Qualcomm Snapdragon 730 does not have integrated graphics.

A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.

The processor has a thermal design power (TDP) of 9 W watts.
TDP indicates the cooling solution needed to effectively manage the processor's heat. It generally provides an approximate indication of the actual power consumption of the CPU itself.

The HiSilicon Kirin 970 is manufactured using a 10 nm process.
A smaller manufacturing process indicates a more contemporary and energy-efficient CPU.
In total, this processor boasts a generous 2.0 MB cache.
A substantial cache can significantly enhance the processor's performance, particularly in scenarios like gaming.