Intel Xeon D-2786NTE vs HiSilicon Kirin 659

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CPU comparison with benchmarks

-VS-

CPU lineage

Intel Xeon D-2786NTE or Intel Xeon D-2786NTE – which processor offers superior performance? In this comparison, we examine disparities and assess which of these two CPUs outperforms the other. We delve into technical specifications and benchmark outcomes.
The Intel Xeon D-2786NTE features 18 processor cores and has the capability to manage 36 threads concurrently.
It was released in Q1/2022 and belongs to the 4 generation of the Intel Xeon D series.
To use the Intel Xeon D-2786NTE, you'll need a motherboard with a BGA 2579 socket.
The HiSilicon Kirin 659 features 8 processor cores and has the capability to manage 8 threads concurrently.
It was released in Q2/2016 and belongs to the 4 generation of the HiSilicon Kirin series.
Desktop / Server Segment Mobile
Intel Xeon D-2786NTE Name HiSilicon Kirin 659
Intel Xeon D Family HiSilicon Kirin
4 Generation 4
Intel Xeon D-2700 Group HiSilicon Kirin 650
 
 

CPU Cores and Base Frequency

The Intel Xeon D-2786NTE has 18 CPU cores and can calculate 36 threads in parallel.
The clock frequency of the Intel Xeon D-2786NTE is 2.1 GHz
and turbo frequency for one core is 3.1 GHz.
The number of CPU cores greatly affects the speed of the processor and is an important performance indicator.
The HiSilicon Kirin 659 has 8 CPU cores and can calculate 8 threads in parallel.
The clock frequency of the A-Core is 2.36 GHz.
Processors with hybrid (big.LITTLE) architecture strike a balance between performance and power efficiency, making them ideal for mobile devices.
3.1 GHz Turbo Frequency (1 core) None
None None 1.7 GHz
None None 2.36 GHz
None None 4x Cortex-A53
None None 4x Cortex-A53
No Overclocking No
normal Core architecture hybrid (big.LITTLE)
2.1 GHz Frequency None
36 Threads 8
Yes Hyperthreading No
18 CPU Cores 8
18x Sunny Cove Cores None
 
 

Internal Graphics

The Intel Xeon D-2786NTE does not have integrated graphics.
The HiSilicon Kirin 659 has integrated graphics, called iGPU for short.
Specifically, the HiSilicon Kirin 659 uses the ARM Mali-T830 MP2, which has 32 texture shaders
and 2 execution units.
The iGPU uses the system's main memory as graphics memory and sits on the processor's die.
-- GPU frequency 0.9 GHz
-- Release date Q4/2015
-- Direct X 11
GPU name ARM Mali-T830 MP2
-- Technology 28 nm
-- Max. displays --
-- Shaders 32
0 bytes Max. GPU Memory 0 bytes
-- Execution units 2
-- Generation Midgard 4
-- GPU (Turbo) --
 
 

Artificial Intelligence and Machine Learning

-- AI specifications --
-- AI hardware --
 
 

Hardware codec support

A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.
-- AVC No
-- VC-1 No
-- VP9 No
-- h265 / HEVC (10 bit) Decode
-- h264 Decode / Encode
-- VP8 Decode / Encode
-- h265 / HEVC (8 bit) Decode / Encode
-- JPEG Decode / Encode
-- AV1 No
 
 

Memory & PCIe

The processor supports a maximum memory capacity of 1.0 TB distributed across 4 memory channels. It offers a peak memory bandwidth of 93.8 GB/s. Both the type and quantity of memory can have a substantial impact on the overall system performance.
4 Memory channels 2
1.0 TB Max. Memory 0 bytes
pci PCIe pci
Yes AES-NI No
Yes ECC No
93.8 GB/s Bandwidth --
DDR4-2933 Memory type LPDDR3-933
 
 

Thermal Management

The processor has a thermal design power (TDP) of 118 W watts.
TDP indicates the cooling solution needed to effectively manage the processor's heat. It generally provides an approximate indication of the actual power consumption of the CPU itself.
-- Tjunction max --
118 W TDP (PL1 / PBP) None
 
 

Technical details

The Intel Xeon D-2786NTE is manufactured using a 10 nm process.
A smaller manufacturing process indicates a more contemporary and energy-efficient CPU.
A substantial cache can significantly enhance the processor's performance, particularly in scenarios like gaming.
The HiSilicon Kirin 659 is manufactured using a 16 nm process.
Q1/2022 Release date Q2/2016
-- Part Number --
27.5 MB L2-Cache 0 bytes
VT-x, VT-x EPT, VT-d Virtualization None
SSE4.1, SSE4.2, AVX2, AVX-512 ISA extensions
Monolithic Chip design Chiplet
Ice Lake Architecture Cortex-A53 / Cortex-A53
10 nm Technology 16 nm
BGA 2579 Socket
Windows 10, Linux Operating systems Android
2141 $ Release price --
Technical data sheet Documents Technical data sheet
x86-64 (64 bit) Instruction set (ISA) ARMv8-A64 (64 bit)
0 bytes L3-Cache 0 bytes