MediaTek Dimensity 8000 vs Qualcomm Snapdragon 870

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CPU comparison with benchmarks

-VS-

CPU lineage

MediaTek Dimensity 8000 or MediaTek Dimensity 8000 – which processor offers superior performance? In this comparison, we examine disparities and assess which of these two CPUs outperforms the other. We delve into technical specifications and benchmark outcomes.
The MediaTek Dimensity 8000 features 8 processor cores and has the capability to manage 8 threads concurrently.
It was released in Q1/2022 and belongs to the 3 generation of the Mediatek Dimensity series.
The Qualcomm Snapdragon 870 features 8 processor cores and has the capability to manage 8 threads concurrently.
It was released in Q2/2021 and belongs to the 7 generation of the Qualcomm Snapdragon series.
Mobile Segment Mobile
MediaTek Dimensity 8000 Name Qualcomm Snapdragon 870
Mediatek Dimensity Family Qualcomm Snapdragon
3 Generation 7
MediaTek Dimensity 8000 Group Qualcomm Snapdragon 865/870
 
 

CPU Cores and Base Frequency

The MediaTek Dimensity 8000 has 8 CPU cores and can calculate 8 threads in parallel.
The clock frequency of the A-Core is 2.75 GHz.
The number of CPU cores greatly affects the speed of the processor and is an important performance indicator.
Processors with hybrid (big.LITTLE) architecture strike a balance between performance and power efficiency, making them ideal for mobile devices.
The Qualcomm Snapdragon 870 has 8 CPU cores and can calculate 8 threads in parallel.
The clock frequency of the A-Core is 3.2 GHz.
None None 4x Kryo 585 Silver
None None 1.8 GHz
2.0 GHz B-Core Frequency 2.42 GHz
2.75 GHz A-Core Frequency 3.2 GHz
4x Cortex-A55 Cores B 3x Kryo 585 Gold
4x Cortex-A78 Cores A 1x Kryo 585 Prime
No Overclocking No
hybrid (big.LITTLE) Core architecture hybrid (Prime / big.LITTLE)
8 Threads 8
No Hyperthreading No
8 CPU Cores 8
 
 

Internal Graphics

The MediaTek Dimensity 8000 has integrated graphics, called iGPU for short.
and 6 execution units.
The iGPU uses the system's main memory as graphics memory and sits on the processor's die.
The Qualcomm Snapdragon 870 has integrated graphics, called iGPU for short.
Specifically, the Qualcomm Snapdragon 870 uses the Qualcomm Adreno 650, which has 512 texture shaders
and 2 execution units.
-- GPU frequency 0.25 GHz
Q2/2021 Release date Q4/2019
12 Direct X 12.0
ARM Mali-G610 MP6 GPU name Qualcomm Adreno 650
4 nm Technology 7 nm
-- Max. displays --
-- Shaders 512
0 bytes Max. GPU Memory 0 bytes
6 Execution units 2
Vallhall 3 Generation 6
-- GPU (Turbo) 0.67 GHz
 
 

Artificial Intelligence and Machine Learning

-- AI specifications --
-- AI hardware --
 
 

Hardware codec support

A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.
Decode / Encode AVC Decode
Decode / Encode VC-1 Decode
Decode / Encode VP9 Decode / Encode
Decode / Encode h265 / HEVC (10 bit) Decode / Encode
Decode / Encode h264 Decode / Encode
Decode / Encode VP8 Decode / Encode
Decode / Encode h265 / HEVC (8 bit) Decode / Encode
Decode / Encode JPEG Decode / Encode
Decode AV1 No
 
 

Memory & PCIe

4 Memory channels 4
0 bytes Max. Memory 16.0 GB
pci PCIe pci
No AES-NI No
No ECC No
-- Bandwidth --
LPDDR5-6400 Memory type LPDDR4X-4266, LPDDR5-5500
 
 

Thermal Management

TDP indicates the cooling solution needed to effectively manage the processor's heat. It generally provides an approximate indication of the actual power consumption of the CPU itself.
The processor has a thermal design power (TDP) of 10 W watts.
-- Tjunction max --
None TDP (PL1 / PBP) 10 W
 
 

Technical details

The MediaTek Dimensity 8000 is manufactured using a 5 nm process.
A smaller manufacturing process indicates a more contemporary and energy-efficient CPU.
A substantial cache can significantly enhance the processor's performance, particularly in scenarios like gaming.
The Qualcomm Snapdragon 870 is manufactured using a 7 nm process.
In total, this processor boasts a generous 3.0 MB cache.
Q1/2022 Release date Q2/2021
MT6895 Part Number SM8250-AC
0 bytes L2-Cache 2.0 MB
None Virtualization None
ISA extensions
Chiplet Chip design Chiplet
Cortex-A78 / Cortex-A55 Architecture Kryo 585
5 nm Technology 7 nm
Socket
Android Operating systems Android
-- Release price --
Technical data sheet Documents Technical data sheet
ARMv8-A64 (64 bit) Instruction set (ISA) ARMv8-A64 (64 bit)
0 bytes L3-Cache 3.0 MB
 
 

MediaTek Dimensity 8000 and Qualcomm Snapdragon 870 in leaderboards