MediaTek Dimensity 900 vs Qualcomm Snapdragon 778G

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CPU comparison with benchmarks

-VS-

CPU lineage

MediaTek Dimensity 900 or MediaTek Dimensity 900 – which processor offers superior performance? In this comparison, we examine disparities and assess which of these two CPUs outperforms the other. We delve into technical specifications and benchmark outcomes.
The MediaTek Dimensity 900 features 8 processor cores and has the capability to manage 8 threads concurrently.
It was released in Q2/2021 and belongs to the 2 generation of the Mediatek Dimensity series.
The Qualcomm Snapdragon 778G features 8 processor cores and has the capability to manage 8 threads concurrently.
It was released in Q2/2021 and belongs to the 4 generation of the Qualcomm Snapdragon series.
Mobile Segment Mobile
MediaTek Dimensity 900 Name Qualcomm Snapdragon 778G
Mediatek Dimensity Family Qualcomm Snapdragon
2 Generation 4
MediaTek Dimensity 900 Group Qualcomm Snapdragon 778
 
 

CPU Cores and Base Frequency

The MediaTek Dimensity 900 has 8 CPU cores and can calculate 8 threads in parallel.
The clock frequency of the A-Core is 2.4 GHz.
The number of CPU cores greatly affects the speed of the processor and is an important performance indicator.
Processors with hybrid (big.LITTLE) architecture strike a balance between performance and power efficiency, making them ideal for mobile devices.
The Qualcomm Snapdragon 778G has 8 CPU cores and can calculate 8 threads in parallel.
None None 4x Kryo 670 Silver
None None 1.9 GHz
2.0 GHz B-Core Frequency 2.2 GHz
2.4 GHz A-Core Frequency 2.4 GHz
6x Cortex-A55 Cores B 3x Kryo 670 Gold
2x Cortex-A78 Cores A 1x Kryo 670 Prime
No Overclocking No
hybrid (big.LITTLE) Core architecture hybrid (Prime / big.LITTLE)
8 Threads 8
No Hyperthreading No
8 CPU Cores 8
 
 

Internal Graphics

The MediaTek Dimensity 900 has integrated graphics, called iGPU for short.
Specifically, the MediaTek Dimensity 900 uses the ARM Mali-G68 MP4, which has 64 texture shaders
and 4 execution units.
The iGPU uses the system's main memory as graphics memory and sits on the processor's die.
The Qualcomm Snapdragon 778G has integrated graphics, called iGPU for short.
Specifically, the Qualcomm Snapdragon 778G uses the Qualcomm Adreno 642L, which has 384 texture shaders
0.85 GHz GPU frequency --
Q2/2020 Release date Q2/2021
12 Direct X 12.0
ARM Mali-G68 MP4 GPU name Qualcomm Adreno 642L
6 nm Technology 6 nm
-- Max. displays --
64 Shaders 384
0 bytes Max. GPU Memory 4.0 GB
4 Execution units 4
Vallhall 2 Generation 5
-- GPU (Turbo) --
 
 

Artificial Intelligence and Machine Learning

-- AI specifications --
-- AI hardware --
 
 

Hardware codec support

A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.
Decode / Encode AVC Decode
Decode / Encode VC-1 Decode
Decode / Encode VP9 Decode / Encode
Decode / Encode h265 / HEVC (10 bit) Decode / Encode
Decode / Encode h264 Decode / Encode
Decode / Encode VP8 Decode / Encode
Decode / Encode h265 / HEVC (8 bit) Decode / Encode
Decode / Encode JPEG Decode / Encode
Decode AV1 No
 
 

Memory & PCIe

4 Memory channels 2
16.0 GB Max. Memory 0 bytes
pci PCIe pci
No AES-NI No
No ECC No
-- Bandwidth --
LPDDR4X, LPDDR5 Memory type LPDDR5-3200
 
 

Thermal Management

The processor has a thermal design power (TDP) of 10 W watts.
TDP indicates the cooling solution needed to effectively manage the processor's heat. It generally provides an approximate indication of the actual power consumption of the CPU itself.
-- Tjunction max --
10 W TDP (PL1 / PBP) None
 
 

Technical details

The MediaTek Dimensity 900 is manufactured using a 6 nm process.
A smaller manufacturing process indicates a more contemporary and energy-efficient CPU.
In total, this processor boasts a generous 2.0 MB cache.
A substantial cache can significantly enhance the processor's performance, particularly in scenarios like gaming.
The Qualcomm Snapdragon 778G is manufactured using a 6 nm process.
Q2/2021 Release date Q2/2021
MT6877V/ZA Part Number SM7325
0 bytes L2-Cache 0 bytes
None Virtualization None
ISA extensions
Chiplet Chip design Chiplet
Cortex-A78 / Cortex-A55 Architecture Kryo 670
6 nm Technology 6 nm
Socket
Android Operating systems Android
-- Release price --
Technical data sheet Documents Technical data sheet
ARMv8-A64 (64 bit) Instruction set (ISA) ARMv8-A64 (64 bit)
2.0 MB L3-Cache 2.0 MB