Qualcomm Snapdragon 680 4G vs HiSilicon Kirin 810

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CPU comparison with benchmarks

-VS-

CPU lineage

Qualcomm Snapdragon 680 4G or Qualcomm Snapdragon 680 4G – which processor offers superior performance? In this comparison, we examine disparities and assess which of these two CPUs outperforms the other. We delve into technical specifications and benchmark outcomes.
The Qualcomm Snapdragon 680 4G features 8 processor cores and has the capability to manage 8 threads concurrently.
It was released in Q1/2022 and belongs to the 6 generation of the Qualcomm Snapdragon series.
The HiSilicon Kirin 810 features 8 processor cores and has the capability to manage 8 threads concurrently.
It was released in Q2/2019 and belongs to the 6 generation of the HiSilicon Kirin series.
Qualcomm Snapdragon 680 Group HiSilicon Kirin 810/820
6 Generation 6
Mobile Segment Mobile
Qualcomm Snapdragon 680 4G Name HiSilicon Kirin 810
Qualcomm Snapdragon Family HiSilicon Kirin
 
 

CPU Cores and Base Frequency

The Qualcomm Snapdragon 680 4G has 8 CPU cores and can calculate 8 threads in parallel.
The clock frequency of the A-Core is 2.4 GHz.
The number of CPU cores greatly affects the speed of the processor and is an important performance indicator.
Processors with hybrid (big.LITTLE) architecture strike a balance between performance and power efficiency, making them ideal for mobile devices.
The HiSilicon Kirin 810 has 8 CPU cores and can calculate 8 threads in parallel.
The clock frequency of the A-Core is 2.2 GHz.
8 Threads 8
1.8 GHz B-Core Frequency 1.9 GHz
8 CPU Cores 8
hybrid (big.LITTLE) Core architecture hybrid (big.LITTLE)
4x Kryo 265 Gold Cores A 2x Cortex-A76
No Hyperthreading No
2.4 GHz A-Core Frequency 2.2 GHz
No Overclocking No
4x Kryo 265 Silver Cores B 6x Cortex-A55
 
 

Internal Graphics

The Qualcomm Snapdragon 680 4G has integrated graphics, called iGPU for short.
Specifically, the Qualcomm Snapdragon 680 4G uses the Qualcomm Adreno 610, which has 128 texture shaders
The iGPU uses the system's main memory as graphics memory and sits on the processor's die.
The HiSilicon Kirin 810 has integrated graphics, called iGPU for short.
Specifically, the HiSilicon Kirin 810 uses the ARM Mali-G52 MP6, which has 288 texture shaders
and 16 execution units.
128 Shaders 288
Q2/2019 Release date Q1/2018
11 nm Technology 12 nm
12.1 Direct X 12
4.0 GB Max. GPU Memory 4.0 GB
-- Max. displays --
-- Execution units 16
-- GPU frequency 0.85 GHz
6 Generation Bifrost 2
-- GPU (Turbo) --
Qualcomm Adreno 610 GPU name ARM Mali-G52 MP6
 
 

Artificial Intelligence and Machine Learning

-- AI specifications --
-- AI hardware --
 
 

Hardware codec support

A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.
Decode VP8 Decode / Encode
Decode VC-1 Decode / Encode
Decode / Encode JPEG Decode / Encode
No AV1 No
Decode h265 / HEVC (8 bit) Decode / Encode
Decode AVC Decode / Encode
Decode / Encode h264 Decode / Encode
Decode VP9 Decode / Encode
Decode h265 / HEVC (10 bit) Decode / Encode
 
 

Memory & PCIe

The processor supports a maximum memory capacity of 4.0 GB distributed across 2 memory channels. It offers a peak memory bandwidth of 17.0 GB/s. Both the type and quantity of memory can have a substantial impact on the overall system performance.
pci PCIe pci
No AES-NI No
LPDDR4X-2133 Memory type LPDDR4X-2133
No ECC No
4.0 GB Max. Memory 6.0 GB
2 Memory channels 4
17.0 GB/s Bandwidth --
 
 

Thermal Management

TDP indicates the cooling solution needed to effectively manage the processor's heat. It generally provides an approximate indication of the actual power consumption of the CPU itself.
The processor has a thermal design power (TDP) of 5 W watts.
None TDP (PL1 / PBP) 5 W
-- Tjunction max --
 
 

Technical details

The Qualcomm Snapdragon 680 4G is manufactured using a 6 nm process.
A smaller manufacturing process indicates a more contemporary and energy-efficient CPU.
A substantial cache can significantly enhance the processor's performance, particularly in scenarios like gaming.
The HiSilicon Kirin 810 is manufactured using a 7 nm process.
In total, this processor boasts a generous 1.0 MB cache.
Q1/2022 Release date Q2/2019
None Virtualization None
ISA extensions
6 nm Technology 7 nm
Chiplet Chip design Chiplet
200 $ Release price --
Kryo 265 Architecture Cortex-A76 / Cortex-A55
0 bytes L3-Cache 1.0 MB
Android Operating systems Android
Technical data sheet Documents Technical data sheet
ARMv8-A64 (64 bit) Instruction set (ISA) ARMv8-A64 (64 bit)
SM6225 Part Number --
Socket
0 bytes L2-Cache 0 bytes