Qualcomm Snapdragon 750G vs HiSilicon Kirin 659

Last updated:

CPU comparison with benchmarks

-VS-

CPU lineage

Qualcomm Snapdragon 750G or Qualcomm Snapdragon 750G – which processor offers superior performance? In this comparison, we examine disparities and assess which of these two CPUs outperforms the other. We delve into technical specifications and benchmark outcomes.
The HiSilicon Kirin 659 features 8 processor cores and has the capability to manage 8 threads concurrently.
It was released in Q2/2016 and belongs to the 4 generation of the HiSilicon Kirin series.
-- Segment Mobile
Qualcomm Snapdragon 750G Name HiSilicon Kirin 659
Family HiSilicon Kirin
-- Generation 4
Group HiSilicon Kirin 650
 
 

CPU Cores and Base Frequency

The HiSilicon Kirin 659 has 8 CPU cores and can calculate 8 threads in parallel.
The clock frequency of the A-Core is 2.36 GHz.
The number of CPU cores greatly affects the speed of the processor and is an important performance indicator.
Processors with hybrid (big.LITTLE) architecture strike a balance between performance and power efficiency, making them ideal for mobile devices.
-- Threads 8
No Hyperthreading No
None None 1.7 GHz
None None 2.36 GHz
None None 4x Cortex-A53
None None 4x Cortex-A53
No Overclocking No
-- Core architecture hybrid (big.LITTLE)
-- CPU Cores 8
 
 

Internal Graphics

The Qualcomm Snapdragon 750G does not have integrated graphics.
The HiSilicon Kirin 659 has integrated graphics, called iGPU for short.
Specifically, the HiSilicon Kirin 659 uses the ARM Mali-T830 MP2, which has 32 texture shaders
and 2 execution units.
The iGPU uses the system's main memory as graphics memory and sits on the processor's die.
-- GPU frequency 0.9 GHz
-- Release date Q4/2015
-- Direct X 11
GPU name ARM Mali-T830 MP2
-- Technology 28 nm
-- Max. displays --
-- Shaders 32
0 bytes Max. GPU Memory 0 bytes
-- Execution units 2
-- Generation Midgard 4
-- GPU (Turbo) --
 
 

Artificial Intelligence and Machine Learning

-- AI specifications --
-- AI hardware --
 
 

Hardware codec support

A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.
-- AVC No
-- VC-1 No
-- VP9 No
-- h265 / HEVC (10 bit) Decode
-- h264 Decode / Encode
-- VP8 Decode / Encode
-- h265 / HEVC (8 bit) Decode / Encode
-- JPEG Decode / Encode
-- AV1 No
 
 

Memory & PCIe

-- Memory channels 2
0 bytes Max. Memory 0 bytes
pci PCIe pci
No AES-NI No
No ECC No
-- Bandwidth --
Memory type LPDDR3-933
 
 

Thermal Management

TDP indicates the cooling solution needed to effectively manage the processor's heat. It generally provides an approximate indication of the actual power consumption of the CPU itself.
-- Tjunction max --
 
 

Technical details

A smaller manufacturing process indicates a more contemporary and energy-efficient CPU.
A substantial cache can significantly enhance the processor's performance, particularly in scenarios like gaming.
The HiSilicon Kirin 659 is manufactured using a 16 nm process.
-- Release date Q2/2016
-- Part Number --
0 bytes L2-Cache 0 bytes
Virtualization None
ISA extensions
-- Chip design Chiplet
-- Architecture Cortex-A53 / Cortex-A53
-- Technology 16 nm
Socket
Operating systems Android
-- Release price --
Technical data sheet Documents Technical data sheet
Instruction set (ISA) ARMv8-A64 (64 bit)
0 bytes L3-Cache 0 bytes