Qualcomm Snapdragon 778G vs HiSilicon Kirin 990 5G

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CPU comparison with benchmarks

-VS-

CPU lineage

Qualcomm Snapdragon 778G or Qualcomm Snapdragon 778G – which processor offers superior performance? In this comparison, we examine disparities and assess which of these two CPUs outperforms the other. We delve into technical specifications and benchmark outcomes.
The Qualcomm Snapdragon 778G features 8 processor cores and has the capability to manage 8 threads concurrently.
It was released in Q2/2021 and belongs to the 4 generation of the Qualcomm Snapdragon series.
The HiSilicon Kirin 990 5G features 8 processor cores and has the capability to manage 8 threads concurrently.
It was released in Q3/2019 and belongs to the 8 generation of the HiSilicon Kirin series.
Qualcomm Snapdragon 778 Group HiSilicon Kirin 990
4 Generation 8
Mobile Segment Mobile
Qualcomm Snapdragon 778G Name HiSilicon Kirin 990 5G
Qualcomm Snapdragon Family HiSilicon Kirin
 
 

CPU Cores and Base Frequency

The Qualcomm Snapdragon 778G has 8 CPU cores and can calculate 8 threads in parallel.
The clock frequency of the A-Core is 2.4 GHz.
The number of CPU cores greatly affects the speed of the processor and is an important performance indicator.
The HiSilicon Kirin 990 5G has 8 CPU cores and can calculate 8 threads in parallel.
The clock frequency of the A-Core is 2.86 GHz.
4x Kryo 670 Silver Cores C 4x Cortex-A55
8 Threads 8
2.2 GHz B-Core Frequency 2.36 GHz
8 CPU Cores 8
hybrid (Prime / big.LITTLE) Core architecture hybrid (Prime / big.LITTLE)
1x Kryo 670 Prime Cores A 2x Cortex-A76
No Hyperthreading No
2.4 GHz A-Core Frequency 2.86 GHz
No Overclocking No
3x Kryo 670 Gold Cores B 2x Cortex-A76
1.9 GHz C-Core Frequency 1.95 GHz
 
 

Internal Graphics

The Qualcomm Snapdragon 778G has integrated graphics, called iGPU for short.
Specifically, the Qualcomm Snapdragon 778G uses the Qualcomm Adreno 642L, which has 384 texture shaders
and 4 execution units.
The iGPU uses the system's main memory as graphics memory and sits on the processor's die.
The HiSilicon Kirin 990 5G has integrated graphics, called iGPU for short.
Specifically, the HiSilicon Kirin 990 5G uses the ARM Mali-G76 MP16, which has 256 texture shaders
and 16 execution units.
384 Shaders 256
Q2/2021 Release date Q3/2018
6 nm Technology 7 nm
12.0 Direct X 12
4.0 GB Max. GPU Memory 4.0 GB
-- Max. displays --
4 Execution units 16
-- GPU frequency 0.6 GHz
5 Generation Bifrost 3
-- GPU (Turbo) --
Qualcomm Adreno 642L GPU name ARM Mali-G76 MP16
 
 

Artificial Intelligence and Machine Learning

-- AI specifications Da Vinci Architecture. 1x Ascend Lite + 1x Ascend Tiny
-- AI hardware HUAWEI HiAI 2.0
 
 

Hardware codec support

A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.
Decode / Encode VP8 Decode / Encode
Decode VC-1 Decode / Encode
Decode / Encode JPEG Decode / Encode
No AV1 No
Decode / Encode h265 / HEVC (8 bit) Decode / Encode
Decode AVC Decode / Encode
Decode / Encode h264 Decode / Encode
Decode / Encode VP9 Decode / Encode
Decode / Encode h265 / HEVC (10 bit) Decode / Encode
 
 

Memory & PCIe

pci PCIe pci
No AES-NI No
LPDDR5-3200 Memory type LPDDR4X-4266
No ECC No
0 bytes Max. Memory 8.0 GB
2 Memory channels 4
-- Bandwidth --
 
 

Thermal Management

TDP indicates the cooling solution needed to effectively manage the processor's heat. It generally provides an approximate indication of the actual power consumption of the CPU itself.
The processor has a thermal design power (TDP) of 6 W watts.
None TDP (PL1 / PBP) 6 W
-- Tjunction max --
 
 

Technical details

The Qualcomm Snapdragon 778G is manufactured using a 6 nm process.
A smaller manufacturing process indicates a more contemporary and energy-efficient CPU.
In total, this processor boasts a generous 2.0 MB cache.
A substantial cache can significantly enhance the processor's performance, particularly in scenarios like gaming.
The HiSilicon Kirin 990 5G is manufactured using a 7 nm process.
Q2/2021 Release date Q3/2019
None Virtualization None
ISA extensions
6 nm Technology 7 nm
Chiplet Chip design Chiplet
-- Release price --
Kryo 670 Architecture Cortex-A76 / Cortex-A55
2.0 MB L3-Cache 2.0 MB
Android Operating systems Android
Technical data sheet Documents Technical data sheet
ARMv8-A64 (64 bit) Instruction set (ISA) ARMv8-A64 (64 bit)
SM7325 Part Number --
Socket
0 bytes L2-Cache 0 bytes