CPU comparison with benchmarks
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-VS- |
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CPU lineage |
Qualcomm Snapdragon 870 or Qualcomm Snapdragon 870 – which processor offers superior performance? In this comparison, we examine disparities and assess which of these two CPUs outperforms the other. We delve into technical specifications and benchmark outcomes. The Qualcomm Snapdragon 870 features 8 processor cores and has the capability to manage 8 threads concurrently. It was released in Q2/2021 and belongs to the 7 generation of the Qualcomm Snapdragon series. The MediaTek Dimensity 8200 features 8 processor cores and has the capability to manage 8 threads concurrently. It was released in Q4/2022 and belongs to the 3 generation of the Mediatek Dimensity series.
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| Mobile |
Segment |
Mobile |
| Qualcomm Snapdragon 870 |
Name |
MediaTek Dimensity 8200 |
| Qualcomm Snapdragon |
Family |
Mediatek Dimensity |
| 7 |
Generation |
3 |
| Qualcomm Snapdragon 865/870 |
Group |
MediaTek Dimensity 8000 4nm |
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CPU Cores and Base Frequency |
The Qualcomm Snapdragon 870 has 8 CPU cores and can calculate 8 threads in parallel. The clock frequency of the A-Core is 3.2 GHz. The number of CPU cores greatly affects the speed of the processor and is an important performance indicator. The MediaTek Dimensity 8200 has 8 CPU cores and can calculate 8 threads in parallel. The clock frequency of the A-Core is 3.1 GHz. Processors with hybrid (big.LITTLE) architecture strike a balance between performance and power efficiency, making them ideal for mobile devices.
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| 4x Kryo 585 Silver |
Cores C |
4x Cortex-A55 |
| 1.8 GHz |
C-Core Frequency |
2.0 GHz |
| 2.42 GHz |
B-Core Frequency |
3.0 GHz |
| 3.2 GHz |
A-Core Frequency |
3.1 GHz |
| 3x Kryo 585 Gold |
Cores B |
3x Cortex-A78 |
| 1x Kryo 585 Prime |
Cores A |
1x Cortex-A78 |
| No |
Overclocking |
No |
| hybrid (Prime / big.LITTLE) |
Core architecture |
hybrid (big.LITTLE) |
| 8 |
Threads |
8 |
| No |
Hyperthreading |
No |
| 8 |
CPU Cores |
8 |
| |
| |
Internal Graphics |
The Qualcomm Snapdragon 870 has integrated graphics, called iGPU for short. Specifically, the Qualcomm Snapdragon 870 uses the Qualcomm Adreno 650, which has 512 texture shaders and 2 execution units. The iGPU uses the system's main memory as graphics memory and sits on the processor's die. The MediaTek Dimensity 8200 has integrated graphics, called iGPU for short. and 6 execution units.
|
| 0.25 GHz |
GPU frequency |
-- |
| Q4/2019 |
Release date |
Q2/2021 |
| 12.0 |
Direct X |
12 |
| Qualcomm Adreno 650 |
GPU name |
ARM Mali-G610 MP6 |
| 7 nm |
Technology |
4 nm |
| -- |
Max. displays |
-- |
| 512 |
Shaders |
-- |
| 0 bytes |
Max. GPU Memory |
0 bytes |
| 2 |
Execution units |
6 |
| 6 |
Generation |
Vallhall 3 |
| 0.67 GHz |
GPU (Turbo) |
-- |
| |
| |
Artificial Intelligence and Machine Learning |
| -- |
AI specifications |
-- |
| -- |
AI hardware |
-- |
| |
| |
Hardware codec support |
A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.
|
| Decode |
AVC |
Decode / Encode |
| Decode |
VC-1 |
Decode / Encode |
| Decode / Encode |
VP9 |
Decode / Encode |
| Decode / Encode |
h265 / HEVC (10 bit) |
Decode / Encode |
| Decode / Encode |
h264 |
Decode / Encode |
| Decode / Encode |
VP8 |
Decode / Encode |
| Decode / Encode |
h265 / HEVC (8 bit) |
Decode / Encode |
| Decode / Encode |
JPEG |
Decode / Encode |
| No |
AV1 |
Decode |
| |
| |
Memory & PCIe |
| 4 |
Memory channels |
4 |
| 16.0 GB |
Max. Memory |
0 bytes |
| pci |
PCIe |
pci |
| No |
AES-NI |
No |
| No |
ECC |
No |
| -- |
Bandwidth |
51.2 GB/s |
| LPDDR4X-4266, LPDDR5-5500 |
Memory type |
LPDDR5-6400 |
| |
| |
Thermal Management |
The processor has a thermal design power (TDP) of 10 W watts. TDP indicates the cooling solution needed to effectively manage the processor's heat. It generally provides an approximate indication of the actual power consumption of the CPU itself.
|
| -- |
Tjunction max |
-- |
| 10 W |
TDP (PL1 / PBP) |
None |
| |
| |
Technical details |
The Qualcomm Snapdragon 870 is manufactured using a 7 nm process. A smaller manufacturing process indicates a more contemporary and energy-efficient CPU. In total, this processor boasts a generous 3.0 MB cache. A substantial cache can significantly enhance the processor's performance, particularly in scenarios like gaming. The MediaTek Dimensity 8200 is manufactured using a 4 nm process.
|
| Q2/2021 |
Release date |
Q4/2022 |
| SM8250-AC |
Part Number |
MT6896 / MT6896Z |
| 2.0 MB |
L2-Cache |
0 bytes |
| None |
Virtualization |
None |
|
ISA extensions |
|
| Chiplet |
Chip design |
Chiplet |
| Kryo 585 |
Architecture |
Cortex-A78 / -A78 / -A55 |
| 7 nm |
Technology |
4 nm |
|
Socket |
|
| Android |
Operating systems |
Android |
| -- |
Release price |
-- |
| Technical data sheet |
Documents |
Technical data sheet |
| ARMv8-A64 (64 bit) |
Instruction set (ISA) |
ARMv8-A64 (64 bit) |
| 3.0 MB |
L3-Cache |
0 bytes |
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