Raspberry Pi 3 B+ (Broadcom BCM2837B0) vs HiSilicon Kirin 9000E

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CPU comparison with benchmarks

-VS-

CPU lineage

Raspberry Pi 3 B+ (Broadcom BCM2837B0) or Raspberry Pi 3 B+ (Broadcom BCM2837B0) – which processor offers superior performance? In this comparison, we examine disparities and assess which of these two CPUs outperforms the other. We delve into technical specifications and benchmark outcomes.
The HiSilicon Kirin 9000E features 8 processor cores and has the capability to manage 8 threads concurrently.
It was released in Q4/2020 and belongs to the 9 generation of the HiSilicon Kirin series.
-- Segment Mobile
Raspberry Pi 3 B+ (Broadcom BCM2837B0) Name HiSilicon Kirin 9000E
Family HiSilicon Kirin
-- Generation 9
Group HiSilicon Kirin 9000
 
 

CPU Cores and Base Frequency

The HiSilicon Kirin 9000E has 8 CPU cores and can calculate 8 threads in parallel.
The clock frequency of the A-Core is 3.13 GHz.
The number of CPU cores greatly affects the speed of the processor and is an important performance indicator.
None None 4x Cortex-A55
-- Threads 8
No Hyperthreading No
None None 2.05 GHz
None None 2.54 GHz
None None 3.13 GHz
None None 3x Cortex-A77
None None 1x Cortex-A77
No Overclocking No
-- Core architecture hybrid (Prime / big.LITTLE)
-- CPU Cores 8
 
 

Internal Graphics

The Raspberry Pi 3 B+ (Broadcom BCM2837B0) does not have integrated graphics.
The HiSilicon Kirin 9000E has integrated graphics, called iGPU for short.
The iGPU uses the system's main memory as graphics memory and sits on the processor's die.
-- GPU frequency 0.76 GHz
-- Release date --
-- Direct X --
GPU name ARM Mali-G78 MP22
-- Technology --
-- Max. displays --
-- Shaders --
0 bytes Max. GPU Memory 0 bytes
-- Execution units --
-- Generation --
-- GPU (Turbo) --
 
 

Artificial Intelligence and Machine Learning

-- AI specifications --
-- AI hardware --
 
 

Hardware codec support

A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.
-- AVC --
-- VC-1 --
-- VP9 --
-- h265 / HEVC (10 bit) --
-- h264 --
-- VP8 --
-- h265 / HEVC (8 bit) --
-- JPEG --
-- AV1 --
 
 

Memory & PCIe

-- Memory channels 4
0 bytes Max. Memory 0 bytes
pci PCIe pci
No AES-NI No
No ECC No
-- Bandwidth --
Memory type LPDDR4X-2133, LPDDR5-2750
 
 

Thermal Management

TDP indicates the cooling solution needed to effectively manage the processor's heat. It generally provides an approximate indication of the actual power consumption of the CPU itself.
-- Tjunction max --
 
 

Technical details

A smaller manufacturing process indicates a more contemporary and energy-efficient CPU.
A substantial cache can significantly enhance the processor's performance, particularly in scenarios like gaming.
The HiSilicon Kirin 9000E is manufactured using a 5 nm process.
-- Release date Q4/2020
-- Part Number --
0 bytes L2-Cache 0 bytes
Virtualization None
ISA extensions
-- Chip design Chiplet
-- Architecture Cortex-A77 / Cortex-A55
-- Technology 5 nm
Socket
Operating systems Android
-- Release price --
Technical data sheet Documents Technical data sheet
Instruction set (ISA) ARMv8-A64 (64 bit)
0 bytes L3-Cache 0 bytes