AMD EPYC 7473X vs HiSilicon Kirin 990 4G

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CPU comparison with benchmarks

-VS-

CPU lineage

AMD EPYC 7473X or AMD EPYC 7473X – which processor offers superior performance? In this comparison, we examine disparities and assess which of these two CPUs outperforms the other. We delve into technical specifications and benchmark outcomes.
The AMD EPYC 7473X features 24 processor cores and has the capability to manage 48 threads concurrently.
It was released in Q2/2022 and belongs to the 3 generation of the AMD EPYC series.
To use the AMD EPYC 7473X, you'll need a motherboard with a SP3 socket.
The HiSilicon Kirin 990 4G features 8 processor cores and has the capability to manage 8 threads concurrently.
It was released in Q3/2019 and belongs to the 8 generation of the HiSilicon Kirin series.
Desktop / Server Segment Mobile
AMD EPYC 7473X Name HiSilicon Kirin 990 4G
AMD EPYC Family HiSilicon Kirin
3 Generation 8
AMD EPYC 7003 Group HiSilicon Kirin 990
 
 

CPU Cores and Base Frequency

The AMD EPYC 7473X has 24 CPU cores and can calculate 48 threads in parallel.
The clock frequency of the AMD EPYC 7473X is 2.8 GHz
and turbo frequency for one core is 3.7 GHz.
The number of CPU cores greatly affects the speed of the processor and is an important performance indicator.
The HiSilicon Kirin 990 4G has 8 CPU cores and can calculate 8 threads in parallel.
The clock frequency of the A-Core is 2.86 GHz.
3.7 GHz Turbo Frequency (1 core) None
None None 4x Cortex-A55
None None 1.86 GHz
None None 2.09 GHz
None None 2.86 GHz
None None 2x Cortex-A76
None None 2x Cortex-A76
No Overclocking No
normal Core architecture hybrid (Prime / big.LITTLE)
2.8 GHz Frequency None
48 Threads 8
Yes Hyperthreading No
24 CPU Cores 8
24x Zen 3 Cores None
 
 

Internal Graphics

The AMD EPYC 7473X does not have integrated graphics.
The HiSilicon Kirin 990 4G has integrated graphics, called iGPU for short.
Specifically, the HiSilicon Kirin 990 4G uses the ARM Mali-G76 MP16, which has 256 texture shaders
and 16 execution units.
The iGPU uses the system's main memory as graphics memory and sits on the processor's die.
-- GPU frequency 0.6 GHz
-- Release date Q3/2018
-- Direct X 12
GPU name ARM Mali-G76 MP16
-- Technology 7 nm
-- Max. displays --
-- Shaders 256
0 bytes Max. GPU Memory 4.0 GB
-- Execution units 16
-- Generation Bifrost 3
-- GPU (Turbo) --
 
 

Artificial Intelligence and Machine Learning

-- AI specifications Da Vinci Architecture. 1x Ascend Lite + 1x Ascend Tiny
-- AI hardware HUAWEI HiAI 2.0
 
 

Hardware codec support

A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.
-- AVC Decode / Encode
-- VC-1 Decode / Encode
-- VP9 Decode / Encode
-- h265 / HEVC (10 bit) Decode / Encode
-- h264 Decode / Encode
-- VP8 Decode / Encode
-- h265 / HEVC (8 bit) Decode / Encode
-- JPEG Decode / Encode
-- AV1 No
 
 

Memory & PCIe

The processor supports a maximum memory capacity of 4.0 TB distributed across 8 memory channels. It offers a peak memory bandwidth of 204.8 GB/s. Both the type and quantity of memory can have a substantial impact on the overall system performance.
8 Memory channels 4
4.0 TB Max. Memory 8.0 GB
pci PCIe pci
Yes AES-NI No
Yes ECC No
204.8 GB/s Bandwidth --
DDR4-3200 Memory type LPDDR4X-2133
 
 

Thermal Management

The processor has a thermal design power (TDP) of 240 W watts.
TDP indicates the cooling solution needed to effectively manage the processor's heat. It generally provides an approximate indication of the actual power consumption of the CPU itself.
The processor has a thermal design power (TDP) of 6 W watts.
280 W TDP up None
-- Tjunction max --
240 W TDP (PL1 / PBP) 6 W
225 W TDP down None
 
 

Technical details

The AMD EPYC 7473X is manufactured using a 7 nm process.
A smaller manufacturing process indicates a more contemporary and energy-efficient CPU.
In total, this processor boasts a generous 768.0 MB cache.
A substantial cache can significantly enhance the processor's performance, particularly in scenarios like gaming.
The HiSilicon Kirin 990 4G is manufactured using a 7 nm process.
In total, this processor boasts a generous 2.0 MB cache.
Q2/2022 Release date Q3/2019
-- Part Number --
32.0 MB L2-Cache 0 bytes
AMD-V, SVM Virtualization None
SSE4a, SSE4.1, SSE4.2, FMA3, AVX2 ISA extensions
Chiplet Chip design Chiplet
Milan (Zen 3) Architecture Cortex-A76 / Cortex-A55
7 nm Technology 7 nm
SP3 Socket
Windows 10, Linux Operating systems Android
4185 $ Release price --
Technical data sheet Documents Technical data sheet
x86-64 (64 bit) Instruction set (ISA) ARMv8-A64 (64 bit)
768.0 MB L3-Cache 2.0 MB