Intel Core2 Duo T5870 vs Intel Celeron J1850

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CPU comparison with benchmarks

-VS-

CPU lineage

Intel Core2 Duo T5870 or Intel Core2 Duo T5870 – which processor offers superior performance? In this comparison, we examine disparities and assess which of these two CPUs outperforms the other. We delve into technical specifications and benchmark outcomes.
The Intel Core2 Duo T5870 features 2 processor cores and has the capability to manage 2 threads concurrently.
It belongs to the 1 generation of the Intel Celeron series.
The Intel Celeron J1850 features 4 processor cores and has the capability to manage 4 threads concurrently.
It was released in Q3/2013 and belongs to the 6 generation of the Intel Celeron series.
To use the Intel Celeron J1850, you'll need a motherboard with a BGA 1170 socket.
1 Generation 6
Intel Celeron Family Intel Celeron
Intel Core 2 Duo T5000 Group Intel Celeron J1000/N2000
Mobile Segment Mobile
Intel Core2 Duo T5870 Name Intel Celeron J1850
 
 

CPU Cores and Base Frequency

The Intel Core2 Duo T5870 has 2 CPU cores and can calculate 2 threads in parallel.
The clock frequency of the Intel Core2 Duo T5870 is 2.0 GHz
The Intel Celeron J1850 has 4 CPU cores and can calculate 4 threads in parallel.
The clock frequency of the Intel Celeron J1850 is 2.0 GHz
No Hyperthreading No
2 CPU Cores 4
2.0 GHz Frequency 2.0 GHz
normal Core architecture normal
No Overclocking No
2 Threads 4
2x Cores 4x
 
 

Internal Graphics

The Intel Core2 Duo T5870 does not have integrated graphics.
The Intel Celeron J1850 has integrated graphics, called iGPU for short.
Specifically, the Intel Celeron J1850 uses the Intel HD Graphics (Bay Trail GT1), which has 32 texture shaders
and 4 execution units.
The iGPU uses the system's main memory as graphics memory and sits on the processor's die.
-- Generation 7
-- Max. displays --
-- Shaders 32
-- GPU (Turbo) 0.79 GHz
-- Direct X 11.2
0 bytes Max. GPU Memory 2.0 GB
-- GPU frequency 0.69 GHz
-- Release date Q3/2013
-- Execution units 4
-- Technology 22 nm
GPU name Intel HD Graphics (Bay Trail GT1)
 
 

Artificial Intelligence and Machine Learning

-- AI specifications --
-- AI hardware --
 
 

Hardware codec support

A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.
-- VC-1 Decode
-- VP8 No
-- JPEG Decode
-- AV1 No
-- h265 / HEVC (8 bit) No
-- h265 / HEVC (10 bit) No
-- AVC Decode / Encode
-- VP9 No
-- h264 Decode / Encode
 
 

Memory & PCIe

The processor supports a maximum memory capacity of 8.0 GB distributed across 2 memory channels. It offers a peak memory bandwidth of 21.3 GB/s. Both the type and quantity of memory can have a substantial impact on the overall system performance.
Memory type DDR3-1333
-- Bandwidth 21.3 GB/s
0 bytes Max. Memory 8.0 GB
No AES-NI No
No ECC No
-- Memory channels 2
pci PCIe pci
 
 

Thermal Management

The processor has a thermal design power (TDP) of 35 W watts.
TDP indicates the cooling solution needed to effectively manage the processor's heat. It generally provides an approximate indication of the actual power consumption of the CPU itself.
The processor has a thermal design power (TDP) of 10 W watts.
35 W TDP (PL1 / PBP) 10 W
100 °C Tjunction max 100 °C
 
 

Technical details

The Intel Core2 Duo T5870 is manufactured using a 65 nm process.
A smaller manufacturing process indicates a more contemporary and energy-efficient CPU.
A substantial cache can significantly enhance the processor's performance, particularly in scenarios like gaming.
The Intel Celeron J1850 is manufactured using a 22 nm process.
In total, this processor boasts a generous 2.0 MB cache.
2.0 MB L2-Cache 0 bytes
Merom (Core) Architecture Bay Trail
0 bytes L3-Cache 2.0 MB
Technical data sheet Documents Technical data sheet
Operating systems Windows 10, Linux
x86-64 (64 bit) Instruction set (ISA) x86-64 (64 bit)
SSE3, MMX, SSE, SSE2 ISA extensions SSE4.1, SSE4.2
-- Release price --
-- Part Number --
VT-x Virtualization VT-x, VT-x EPT
Socket BGA 1170
-- Release date Q3/2013
Monolithic Chip design Monolithic
65 nm Technology 22 nm