Qualcomm Snapdragon 430 vs Intel Xeon W-1370P

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CPU comparison with benchmarks

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CPU lineage

Qualcomm Snapdragon 430 or Qualcomm Snapdragon 430 – which processor offers superior performance? In this comparison, we examine disparities and assess which of these two CPUs outperforms the other. We delve into technical specifications and benchmark outcomes.
The Intel Xeon W-1370P features 8 processor cores and has the capability to manage 16 threads concurrently.
It was released in Q2/2021 and belongs to the 11 generation of the Intel Xeon W series.
To use the Intel Xeon W-1370P, you'll need a motherboard with a LGA 1200 socket.
Group Intel Xeon W-1300
-- Generation 11
-- Segment Desktop / Server
Qualcomm Snapdragon 430 Name Intel Xeon W-1370P
Family Intel Xeon W
 
 

CPU Cores and Base Frequency

The Intel Xeon W-1370P has 8 CPU cores and can calculate 16 threads in parallel.
The clock frequency of the Intel Xeon W-1370P is 3.6 GHz
and turbo frequency for one core is 5.2 GHz.
The number of CPU cores greatly affects the speed of the processor and is an important performance indicator.
None None 4.4 GHz
None None 8x
None None 3.6 GHz
-- Threads 16
No Overclocking No
-- CPU Cores 8
-- Core architecture normal
None None 5.2 GHz
No Hyperthreading Yes
 
 

Internal Graphics

The Qualcomm Snapdragon 430 does not have integrated graphics.
The Intel Xeon W-1370P has integrated graphics, called iGPU for short.
Specifically, the Intel Xeon W-1370P uses the Intel UHD Graphics P750, which has 256 texture shaders
and 64 execution units.
The iGPU uses the system's main memory as graphics memory and sits on the processor's die.
-- Direct X 12
-- Generation 12
-- Max. displays --
-- Release date Q2/2021
-- Technology 14 nm
GPU name Intel UHD Graphics P750
-- Execution units 64
-- GPU frequency 0.35 GHz
0 bytes Max. GPU Memory 32.0 GB
-- GPU (Turbo) 1.3 GHz
-- Shaders 256
 
 

Artificial Intelligence and Machine Learning

-- AI hardware --
-- AI specifications --
 
 

Hardware codec support

A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.
-- VP9 Decode / Encode
-- h265 / HEVC (8 bit) Decode / Encode
-- h264 Decode / Encode
-- AVC Decode / Encode
-- VP8 Decode
-- AV1 Decode
-- VC-1 Decode
-- JPEG Decode / Encode
-- h265 / HEVC (10 bit) Decode / Encode
 
 

Memory & PCIe

The processor supports a maximum memory capacity of 128.0 GB distributed across 2 memory channels. It offers a peak memory bandwidth of 51.2 GB/s. Both the type and quantity of memory can have a substantial impact on the overall system performance.
Memory type DDR4-3200
-- Memory channels 2
pci PCIe pci
No AES-NI Yes
-- Bandwidth 51.2 GB/s
0 bytes Max. Memory 128.0 GB
No ECC Yes
 
 

Thermal Management

TDP indicates the cooling solution needed to effectively manage the processor's heat. It generally provides an approximate indication of the actual power consumption of the CPU itself.
The processor has a thermal design power (TDP) of 125 W watts.
None TDP down 95 W
-- Tjunction max 100 °C
None TDP (PL1 / PBP) 125 W
 
 

Technical details

A smaller manufacturing process indicates a more contemporary and energy-efficient CPU.
A substantial cache can significantly enhance the processor's performance, particularly in scenarios like gaming.
The Intel Xeon W-1370P is manufactured using a 14 nm process.
-- Architecture Rocket Lake S
Virtualization VT-x, VT-x EPT, VT-d
-- Technology 14 nm
0 bytes L2-Cache 16.0 MB
-- Part Number --
Instruction set (ISA) x86-64 (64 bit)
Socket LGA 1200
Operating systems Windows 10, Linux
Technical data sheet Documents Technical data sheet
-- Release price 428 $
0 bytes L3-Cache 0 bytes
-- Chip design Monolithic
-- Release date Q2/2021
ISA extensions SSE4.1, SSE4.2, AVX2, AVX-512
 
 

Benchmarks