Qualcomm Snapdragon 810 vs HiSilicon Kirin 955

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CPU comparison with benchmarks

-VS-

CPU lineage

Qualcomm Snapdragon 810 or Qualcomm Snapdragon 810 – which processor offers superior performance? In this comparison, we examine disparities and assess which of these two CPUs outperforms the other. We delve into technical specifications and benchmark outcomes.
The HiSilicon Kirin 955 features 8 processor cores and has the capability to manage 8 threads concurrently.
It was released in Q2/2016 and belongs to the 4 generation of the HiSilicon Kirin series.
Family HiSilicon Kirin
Group HiSilicon Kirin 950
-- Generation 4
Qualcomm Snapdragon 810 Name HiSilicon Kirin 955
-- Segment Mobile
 
 

CPU Cores and Base Frequency

The HiSilicon Kirin 955 has 8 CPU cores and can calculate 8 threads in parallel.
The clock frequency of the A-Core is 2.5 GHz.
The number of CPU cores greatly affects the speed of the processor and is an important performance indicator.
Processors with hybrid (big.LITTLE) architecture strike a balance between performance and power efficiency, making them ideal for mobile devices.
-- CPU Cores 8
No Hyperthreading No
None None 1.8 GHz
None None 4x Cortex-A72
No Overclocking No
None None 4x Cortex-A53
-- Core architecture hybrid (big.LITTLE)
-- Threads 8
None None 2.5 GHz
 
 

Internal Graphics

The Qualcomm Snapdragon 810 does not have integrated graphics.
The HiSilicon Kirin 955 has integrated graphics, called iGPU for short.
Specifically, the HiSilicon Kirin 955 uses the ARM Mali-T880 MP4, which has 64 texture shaders
and 4 execution units.
The iGPU uses the system's main memory as graphics memory and sits on the processor's die.
-- Release date Q2/2016
-- GPU frequency 0.9 GHz
-- GPU (Turbo) 0.9 GHz
-- Max. displays --
-- Execution units 4
-- Generation Midgard 4
GPU name ARM Mali-T880 MP4
-- Direct X 11
-- Shaders 64
0 bytes Max. GPU Memory 0 bytes
-- Technology 16 nm
 
 

Artificial Intelligence and Machine Learning

-- AI hardware --
-- AI specifications --
 
 

Hardware codec support

A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.
-- VP9 No
-- h265 / HEVC (8 bit) Decode / Encode
-- AVC No
-- VP8 Decode / Encode
-- h264 Decode / Encode
-- JPEG Decode / Encode
-- VC-1 No
-- h265 / HEVC (10 bit) Decode
-- AV1 No
 
 

Memory & PCIe

Memory type LPDDR3, LPDDR4
-- Bandwidth --
-- Memory channels 2
No ECC No
0 bytes Max. Memory 0 bytes
No AES-NI No
pci PCIe pci
 
 

Thermal Management

TDP indicates the cooling solution needed to effectively manage the processor's heat. It generally provides an approximate indication of the actual power consumption of the CPU itself.
-- Tjunction max --
 
 

Technical details

A smaller manufacturing process indicates a more contemporary and energy-efficient CPU.
A substantial cache can significantly enhance the processor's performance, particularly in scenarios like gaming.
The HiSilicon Kirin 955 is manufactured using a 16 nm process.
-- Release date Q2/2016
Technical data sheet Documents Technical data sheet
Operating systems Android
-- Release price --
-- Chip design Chiplet
Socket
Instruction set (ISA) ARMv8-A64 (64 bit)
0 bytes L3-Cache 0 bytes
ISA extensions
-- Part Number --
Virtualization None
0 bytes L2-Cache 0 bytes
-- Technology 16 nm
-- Architecture Cortex-A72 / Cortex-A53