MediaTek Dimensity 9000 Benchmark, Test and specs

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CPU lineage

The MediaTek Dimensity 9000 features 8 processor cores and has the capability to manage 8 threads concurrently. It was released in Q1/2022 and belongs to the 3 generation of the Mediatek Dimensity series.
Name: MediaTek Dimensity 9000
Family: Mediatek Dimensity
Group: MediaTek Dimensity 9000
Segment: Mobile
Generation: 3

CPU Cores and Base Frequency

The MediaTek Dimensity 9000 has 8 CPU cores and can calculate 8 threads in parallel. The clock frequency of the A-Core is 3.05 GHz. The number of CPU cores greatly affects the speed of the processor and is an important performance indicator.
CPU Cores: 8
Threads: 8
Cores A: 1x Cortex-X2
Cores B: 3x Cortex-A710
Cores C: 4x Cortex-A510
Core architecture: hybrid (Prime / big.LITTLE)
Hyperthreading: No
Overclocking: No
A-Core Frequency: 3.05 GHz
B-Core Frequency: 2.85 GHz
C-Core Frequency: 1.8 GHz

Internal Graphics

The MediaTek Dimensity 9000 has integrated graphics, called iGPU for short. and 10 execution units. The iGPU uses the system's main memory as graphics memory and sits on the processor's die.
GPU name: ARM Mali-G710 MP10
GPU frequency: 0.85 GHz
GPU (Turbo): --
Execution units: 10
Shaders: --
Max. GPU Memory: 0 bytes
Max. displays: --
Generation: Vallhall 3
Direct X: 12
Technology: 4 nm
Release date: Q2/2021

Hardware codec support

A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.
h265 / HEVC (8 bit): Decode / Encode
h265 / HEVC (10 bit): Decode / Encode
h264: Decode / Encode
VP8: Decode / Encode
VP9: Decode / Encode
AV1: Decode
AVC: Decode / Encode
VC-1: Decode / Encode
JPEG: Decode / Encode

Memory & PCIe

Memory type: LPDDR5-7500
Max. Memory: 0 bytes
Memory channels: 4
Bandwidth: 60.0 GB/s
ECC: No
PCIe: pci
AES-NI: No

Thermal Management

TDP indicates the cooling solution needed to effectively manage the processor's heat. It generally provides an approximate indication of the actual power consumption of the CPU itself.
TDP (PL1 / PBP): None
TDP (PL2): None
TDP up: None
TDP down: None
Tjunction max: --

Technical details

The MediaTek Dimensity 9000 is manufactured using a 4 nm process. A smaller manufacturing process indicates a more contemporary and energy-efficient CPU. A substantial cache can significantly enhance the processor's performance, particularly in scenarios like gaming.
Technology: 4 nm
Chip design: Chiplet
Socket:
L2-Cache: 0 bytes
L3-Cache: 0 bytes
Architecture: Cortex-X2 / -A710 / -A510
Operating systems: Android
Virtualization: None
Instruction set (ISA): ARMv9-A64 (64 bit)
ISA extensions:
Release date: Q1/2022
Release price: --
Part Number: MT6983
Documents: Technical data sheet
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Benchmarks

AnTuTu 9 Benchmark

MediaTek Dimensity 9000+
8C 8T @ 3.2 GHz
1083170
1083170
Qualcomm Snapdragon 8+ Gen 1
8C 8T @ 3.2 GHz
1032680
1032680
MediaTek Dimensity 9000
8C 8T @ 3.05 GHz
1014250
1014250
Qualcomm Snapdragon 7+ Gen 2
8C 8T @ 2.91 GHz
1010270
1010270
Qualcomm Snapdragon 8 Gen 1
8C 8T @ 3.0 GHz
948574
948574

Estimated results for PassMark CPU Mark

Intel Xeon E-2224G
4C 4T @ 3.5 GHz
7617
7617
MediaTek Dimensity 8000
8C 8T @ 2.75 GHz
7613
7613
MediaTek Dimensity 9000
8C 8T @ 3.05 GHz
7566
7566
Intel Xeon E3-1271 v3
4C 8T @ 3.6 GHz
7554
7554
Intel Core i7-7700T
4C 8T @ 2.9 GHz
7539
7539

Geekbench 5, 64bit (Multi-Core)

Intel Xeon E3-1230 v5
4C 8T @ 3.4 GHz
4362
4362
Intel Xeon E-2314
4C 4T @ 2.8 GHz
4339
4339
MediaTek Dimensity 9000
8C 8T @ 3.05 GHz
4335
4335
Intel Xeon E3-1275 v5
4C 8T @ 3.6 GHz
4328
4328
Intel Xeon W-2223
4C 8T @ 3.6 GHz
4328
4328

Geekbench 5, 64bit (Single-Core)

Intel Xeon W-2255
10C 20T @ 3.7 GHz
1272
1272
AMD Ryzen 7 3800X
8C 16T @ 3.9 GHz
1271
1271
MediaTek Dimensity 9000
8C 8T @ 3.05 GHz
1270
1270
Intel Xeon W-2245
8C 16T @ 3.9 GHz
1268
1268
Intel Xeon Silver 4309Y
8C 16T @ 2.8 GHz
1268
1268